Aorun-2518 black potting compound AB glue driver pcb electronic two component silicone potting mix adhesive potting compound
Quick Detail:
| Name | Potting glue | Application |
PCB, electronic components, sensor, cable, wire,
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| Type | Epoxy two-component | Function |
1.Comply with American UL standard, 94V0 grade, UL number: E513688 2.Low viscosity, good fluidity, easy to penetrate;
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1. Comply with American UL standard, 94V0 grade, UL number: E513688
2. Low viscosity, good fluidity, easy to penetrate;
3. moderate curing speed; thermal conductivity between 1.2~1.5.
4. After curing, no bubbles, smooth surface, high heat resistance, good gloss and high hardness;
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Items
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Units/conditions
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Technical Data
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Viscosity
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Shore-D
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80-85
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Volume resistivity
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25℃/ Ω./ cm
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4.3x1015
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Surface resistivity
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25℃/ Ω.
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2.6x1014
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Dielectric strength
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25℃ KV/MM
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25
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Coefficient of linear expansion
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CM/K
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<6.1x10-5
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Glass transition temperature
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℃
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>90
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Temperature resistant
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℃
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-60~120
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2. When the hardness is higher than 82D (Shaw hardness), it can be directly polished.
3. The mixing quantity should not exceed 5kg, and the casting thickness should not exceed 3cm each layer.
4. When the temperature is higher than 25 degrees Celsius, it will cure faster, please reduce the number of mixing/casting by half, or it will be hardened in the container;
5. Curing time will be depend on room temperature and casting thickness , the room temperature higher it is, the faster curing it does. The thinner it cast the longer curing time it needs;
