Epoxy Resin AB Glue Potting Glue For Electronic Components Surface Encapsulation
Quick Detail:
| Name |
Epoxy Resin 1354 |
Usage |
Epoxy floor coatings |
|
Mixing Ratio |
A: B =2:1 (By weight) | Applications |
Epoxy floor coatings,Electronic component potting epoxy compound |
silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity and excellent chemical resistance. Potting and encapsulating compounds provide reliable long term performance for microelectronic, electronic, electrical devices, components including:
Power supplies
Switches
Ignition coils
Electronic modules
Motors
Connectors
Sensors
Cable harness assemblies
Capacitors
Transformers
Rectifiers
| Items | Units/conditions |
Technical Data
|
| Viscosity | Shore-D | 80-85 |
| Volume resistivity | 25℃/ Ω./ cm | 4.3x1015 |
| Surface resistivity | 25℃/ Ω. | 2.6x1014 |
| Dielectric strength | 25℃ KV/MM | 25 |
| Coefficient of linear expansion | CM/K | <6.1x10-5 |
| Glass transition temperature | ℃ | >90 |
| Temperature resistant | ℃ | -60~120 |
FAQ:
Q: Can you offer samples?
A: Yes, we offer samples as you requested.
Q: How about the MOQ ?
A: No MOQ for the standard product.
Q: What's the MOQ ?
1600KG
Q: How about the lead time?
A: In General, the lead time will be 2 weeks for normal order quantity. For mass order, it is negotiable.
